類別 |
項目 |
2007 |
2008 |
備註 |
Mass production |
Prototype |
Target |
General 一般 |
Layers counts (conventional PCB) |
傳統板製作層數 |
2~18 L |
20 L |
2~20 L |
16L量產 |
Layers counts (IVH Board) |
盲埋孔層數 |
一階 |
二階 |
二階 |
含RCC |
Max. Working Size (inch) |
最大工作尺寸 |
24" x 27.9 " |
depend on
customer design |
24" x 27.9 " |
內層 |
Min. Working Size (inch) |
最小工作尺寸 |
11" x 13 " |
11" x 13 " |
|
Copper Foil ( inner ) |
內層銅箔厚度 |
1/3 - 2 oz |
3 oz |
1/3 - 3 oz |
|
Min. Thickness ( core ) |
內層最薄厚度 |
2 mil 1/1 |
2 mil H/H |
2 mil H/H |
|
Impedance Control |
特性阻抗控制 |
+- 10 % |
+- 8 % |
+- 10 % |
|
Inner Layer 內層 |
Min.Line Width/Space (inner layer) |
1/1 oz |
3.0 / 3.0 mil |
2.5 / 2.5 mil |
2.5 / 2.5 mil |
|
H/H oz |
2.5 / 2.5 mil |
2.0 / 2.0 mil |
2.0 / 2.0 mil |
|
Impedance Control L/W |
特性阻抗線寬 |
+-10 % |
+- 8 % |
+-10 % |
|
No Impedance Control L/W (1oz Cu) |
非特性阻抗線寬 |
+- 15 % |
+- 10 % |
+- 10 % |
|
No Impedance Control L/W (2oz Cu) |
非特性阻抗線寬 |
+- 20 % |
+- 15 % |
+- 15 % |
|
Lamination 整合 |
Thickness Tolerance 板厚公差 |
< 20 mil |
+- 2.0 mil |
+- 1.8 mil |
+- 2.0 mil |
|
< 62 mil |
+- 3.0 mil |
+- 2.8 mil |
+- 3.0 mil |
|
< 62 mil |
+- 5.0 % |
+- 4.5 % |
+- 5.0 % |
|
Delec-Thickness Tolerance |
介電層厚度<3.0mil者,公差 |
+- 0.3 mil |
+- 0.3 mil |
+- 0.3 mil |
|
介電層厚度>3.0mil者,公差 |
+- 10 % |
+- 10 % |
+- 10 % |
|
Layer to Layer Registration |
層間精準度 |
< 4.0 mil |
< 3.0 mil |
< 4.0 mil |
|
Tooling Hole Pitch |
靶距漲縮值(傳統板) |
+- 6.0 mil |
+- 5.0 mil |
+- 6.0 mil |
|
Tooling Hole Pitch |
靶距漲縮值(HDI板) |
+- 6.0 mil |
+- 6.0 mil |
+- 6.0 mil |
依族群管理 |
Outline Dimension Tolerance |
成型撈邊公差 |
+- 20 mil |
+- 15 mil |
+- 20 mil |
|
Warpage Tolerance |
板彎翹公差 |
0.70% |
0.65% |
0.70% |
|
Drill 鑽孔 (Subcontract外包) |
Pad Over Drill Size (annular ring) |
最小孔環 |
3.5 mil |
3 mil |
3.5 mil |
|
Inner Layer Clearance Size |
內層隔離單邊尺寸 |
Min. 6 mil |
Min. 5 mil |
Min. 6 mil |
|
Min. Drill Hole Size |
最小機鑽鑽孔孔徑 |
Subcontract capability & Depend on customer Design
& Requirement
|
|
Min. Laser drill Hole Size |
雷射最小鑽孔孔徑 |
|
Pad Over Blind Via Size (annular ring) |
雷射鑽孔可偏移度 |
|
Plating 電鍍 |
Panel Plating Tolerance (Through hole) |
孔銅公差(孔銅鍍1mil) |
+- 0.10 mil |
+- 0.07 mil |
+- 0.10 mil |
plating
1 mil Cu |
Panel Plating Tolerance (surface) |
面銅公差(孔銅鍍1mil) |
+- 0.2 mil |
+- 0.15 mil |
+- 0.15 mil |
Aspect Ratio (PTH) |
機鑽孔徑縱橫比(最小孔徑9.8mil) |
8 : 1 |
9 : 1 |
8 : 1 |
板厚max:75mil |
Outer Layer 外層 |
Min.Line Width/Space (outer layer) |
外層最小線寬/間距 |
3.0 / 3.0 mil |
2.5 / 2.5 mil |
3.0/ 3.0 mil |
1oz |
Impedance Control L/W |
特性阻抗線寬 |
+-10 % |
+-8 % |
+-10 % |
|
No Impedance Control L/W (30 um Cu) |
非特性阻抗線寬 |
+- 15% |
+-10 % |
+- 10 % |
|
Comformal Mask |
銅窗尺寸(Min.4.5 mil) |
+- 10 % |
+- 8 % |
+- 10 % |
|
Remarks：
1. 本表規格為M/L代工使用 。
2. PP直接填孔及樹脂塞孔BY CASE洽談 。 |
